Embedded Module TQMx110EBCOM Express® Basic Type 6 Module with 11th Generation Intel® Core™ Processors

Code name: Tiger Lake H (45)

  • 11th Generation Intel® Core™ i7 and Intel® Core™ i5 processors
  • Desktop / Mobile Workstation Performance
  • Up to 8 Cores / 16 Threads with up to 4.6 GHz Turbo and 24 MB cache
  • New outstanding Intel® Iris® Xe Graphics performance with 8K high-resolution outputs
  • Flexible high-speed Memory Configuration with up to 64 GB
  • High-bandwidth extendability through PCIe Gen4 x16 PEG Port
  • High-speed peripheral interfaces with USB 3.2 Gen 2 (10 Gb/s) support
  • 2.5 Gb Ethernet
  • High CPU power effiency with max. 45 W TDP
The TQMx110EB offers a new class of computing, graphics and system performance based on high-end mobile computing processors. The 11th generation Intel® Core™ processors are based on the latest microarchitecture and are particularly energy-efficient thanks to the 10nm manufacturing process. Equipped with up to 8 cores / 16 threads, 24 MB cache and powerful Intel® Iris® Xe graphics (12th generation), the module is particularly suitable for demanding applications in the fields of gaming, infotainment/entertainment, virtual reality, medical technology and industrial automation.
A special focus is on AI and image processing, which additionally benefit from the new vector neural networks instrucrion set(VNNI).
The 16 PCIe Gen 4 lanes provided directly via the CPU as well as up to 64 GB of ultra-fast DDR4-32000 memory ensure outstanding system performance including powerful expansion options.
Additional high-speed interfaces for peripherals and super fast network connectivity are provided via the new chipset generation.

CPU/Processor data

  • Intel® Core™ i7-11800H <br />(8 × 2.4 GHz / 4.6 GHz Turbo, 24 MB Cache, 45 W (cTDP 35 W), 0 °C – 100 °C)
  • Intel® Core™ i5-11400H<br />(6 × 2.6 GHz / 4.5 GHz Turbo, 12 MB Cache, 45 W (cTDP 35 W), 0 °C – 100 °C)


  • 2x DDR4 SO-DIMM socket with max. 64 Gbyte, dual channel DDR4 up to 3200 MT/s SO-DIMM modules
  • Onboard soldered NVMe SSD (PCIe Gen3 x4) up to 1 Tbyte (option)
  • 32 kbit (24AA32) (option)


  • Up to 4 indepenedant displays:<br />3x Digital Display Interface / DP++ with up to 8K; DisplayPort 1.4a with support for Multi-Stream Transport (MST)<br />1x Embedded Digital Display Interface (eDP) or dual channel LVDS interface (eDP 1.4b or dual channel LVDS)

Communication interfaces

  • 1x 2.5 Gb Ethernet (Intel® i225)
  • 4x USB 3.2 Gen2 (up to 10 Gb/s) with USB 3.0 compatibility
  • 8x USB 2.0

Andere Schnittstellen

  • 1x PEG-Port: PCIe Gen4 (up to 16 Gb/s per lane) (1x16, 2x8 or 2x4+1x8)
  • 8x PCIe Gen3 (up to 8 Gb/s) (8x1, 4x2 or 2x4)
  • 4x SATA Gen3 (up to 6 Gb/s)
  • 1x LPC/eSPI
  • 1x I2C (master/slave capable), 2nd port optional
  • 1x SMBus
  • 1x SPI (for exteral UEFI BIOS flash)
  • 2x UART (Rx/Tx) (4-wire with special configuration through TQ-flexiCFG)
  • 8x GPIO through TQ-flexiCFG

Other functions

  • 1x TPM 2.0 (SLM9670) (Option) or internal firmware TPM (FTPM)
  • TQMx86 board controller with watchdog and flexiCFG Hardware monitor

General data/basic data

Plug-in System:
  • COM Express® Basic, type 6
  • 125 mm x 95 mm
Temperature range:
  • Standard temperature: 0°C…+60°C
Power supply:
  • Voltage: 14.5 V...20 V, 5 V Standby (optional), 3 V Battery for RTC
Power consumption:
  • Power: typ. 25...30 W / max. 60 W (preliminary)


OS Support:
  • Windows 10 / Windows 10 IoT Enterprise
  • Linux


Intel® Core™ i7-11800H, no onboard SSD, TPM 2.0


Intel® Core™ i5-11400H, no onboard SSD, no TPM

Further information


Application examples

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