Embedded Module TQMx110EBCOM Express® Basic Type 6 Module with 11th Generation Intel® Core™ and Intel® Xeon® W-11000E Series Processors

Code name: Tiger Lake H (45)

TQMx110EB
  • 11th Generation Intel® Core™ i7, Intel® Core™ i5, Intel® Core™ i3 processors
  • Intel® Xeon® W-11000E series processors
  • Desktop / Mobile Workstation performance
  • Up to 8 cores / 16 threads with up to 4,7 GHZ turbo and 24 MB Cache
  • New outstanding Intel® Iris® Xe graphics performance with 8K high-resolution outputs
  • Flexible high-speed DDR4-3200 memeory configuration with up to 64 GB
  • High-bandwidth extandability through PCIe Gen4 x16 PEG port
  • High-speed peripheral and network interfaces with USB 3.2 Gen2 (10 Gb/s) and 2.5 Gigabit Ethernet
  • For industrial use conditions, with extended temperature option
  • High CPU power efficiency with max. 25 / 35 / 45 W TDP
The TQMx110EB offers a new class of computing, graphics and system performance based on high-end mobile computing processors. The 11th generation Intel® Core™ and Intel® Xeon® W-11000E series processors are based on the latest microarchitecture and are particularly energy-efficient thanks to the 10nm manufacturing process. Equipped with up to 8 cores / 16 threads, 24 MB cache and powerful Intel® Iris® Xe graphics (12th generation), the module is particularly suitable for demanding applications in the fields of gaming, machine vision, virtual reality, medical technology and industrial automation.
A special focus is on AI and image processing, which additionally benefit from the new vector neural networks instrucrion set(VNNI).
The 16 PCIe Gen 4 lanes provided directly via the CPU as well as up to 64 GB of ultra-fast DDR4-32000 memory ensure outstanding system performance including powerful expansion options.
Additional high-speed interfaces for peripherals and super fast network connectivity are provided via the new chipset generation.

CPU/Processor data

CPU/Processor:
  • Intel® Core™ i7-11850HE (8-Core, 2.6/4.7 GHz, 24 MB, 32 EU, 35/45 W TDP)
  • Intel® Core™ i5-11500HE (6-Core, 2.6/4.5 GHz, 12 MB, 32 EU, 35/45 W TDP)
  • Intel® Core™ i3-11100HE (4-Core, 2.4/4.4 GHz, 8 MB, 16 EU, 35/45 W TDP)
  • Intel® Xeon® W-11865MRE (8-Core, 2.6/4.7 GHz, 24 MB, 32 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP)
  • Intel® Xeon® W-11555MRE (6-Core, 2.6/4.5 GHz, 12 MB, 32 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP)
  • Intel® Xeon® W-11155MRE (4-Core, 2.4/4.4 GHz, 8 MB, 16 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP)
  • Intel® Xeon® W-11865MLE (8-Core, 1.5/4.5 GHz, 24 MB, 32 EU, ECC, 24/7, RT, 25 W TDP)
  • Intel® Xeon® W-11555MLE (6-Core, 1.9/4.4 GHz, 12 MB, 32 EU, ECC, 24/7, RT, 25 W TDP)
  • Intel® Xeon® W-11155MLE (4-Core, 1.8/3.1 GHz, 8 MB, 16 EU, ECC, 24/7, RT, 25 W TDP)

Memory

DDR4:
  • 2x DDR4 SO-DIMM socket with max. 64 Gbyte, dual channel DDR4 up to 3200 MT/s SO-DIMM modules
  • ECC support (only on Intel® Xeon®)
M.2:
  • Onboard soldered NVMe SSD (PCIe Gen3 x4) up to 1 Tbyte (option)
EEPROM:
  • 32 kbit (24AA32) (option)

Graphics

Display:
  • Up to 4 indepenedant displays:<br />3x Digital Display Interface / DP++ with up to 8K; DisplayPort 1.4a with support for Multi-Stream Transport (MST)<br />1x Embedded Digital Display Interface (eDP) or dual channel LVDS interface (eDP 1.4b or dual channel LVDS)

Communication interfaces

Ethernet:
  • 1x 2.5 Gb Ethernet (Intel® i225)
USB:
  • 4x USB 3.2 Gen2 (up to 10 Gb/s) with USB 3.0 compatibility
  • 8x USB 2.0

Andere Schnittstellen

PCIe:
  • 1x PEG-Port: PCIe Gen4 (up to 16 Gb/s per lane) (1x16, 2x8 or 2x4+1x8)
  • 8x PCIe Gen3 (up to 8 Gb/s) (8x1, 4x2 or 2x4)
SATA:
  • 4x SATA Gen3 (up to 6 Gb/s)
LPC:
  • 1x LPC/eSPI
I2C:
  • 1x I2C (master/slave capable), 2nd port optional
SMBus:
  • 1x SMBus
SPI:
  • 1x SPI (for exteral UEFI BIOS flash)
UART:
  • 2x UART (Rx/Tx) (4-wire with special configuration through TQ-flexiCFG)
GPIO:
  • 8x GPIO through TQ-flexiCFG

Other functions

TPM:
  • 1x TPM 2.0 (SLM9670) (Option) or internal firmware TPM (FTPM)
Watchdog:
  • TQMx86 board controller with watchdog and flexiCFG Hardware monitor

General data/basic data

Plug-in System:
  • COM Express® Basic, type 6
Dimensions:
  • 125 mm x 95 mm
Temperature range:
  • Standard temperature: 0°C…+60°C
  • Extended temperature: -40°C...+60°C (only on Intel® Xeon® W-xxxxxMRE)
Power supply:
  • Voltage: 14.5 V...20 V, 5 V Standby (optional), 3 V Battery for RTC
Power consumption:
  • Power: typ. 30...50 W / max. 200 W (preliminary)

OS-Support

OS Support:
  • Windows 10 / Windows 10 IoT Enterprise
  • Linux

TQMx110EB-AA

Intel® Core™ i7-11800H, no onboard SSD, TPM 2.0

TQMx110EB-AB

Intel® Core™ i5-11400H, no onboard SSD, no TPM

TQMx110EB-AC

Intel® Core™ i3-11100HE (4-Core, 2.4/4.4 GHz, 8 MB, 16 EU, 35/45 W TDP), HM570E, no onboard SSD, TPM 2.0, C-Temp
 

TQMx110EB-AD

Intel® Xeon® W-11865MRE (8-Core, 2.6/4.7 GHz, 24 MB, 32 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions with I-Temp
 

TQMx110EB-AE

Intel® Xeon® W-11555MRE (6-Core, 2.6/4.5 GHz, 12 MB, 32 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions I-Temp
 

TQMx110EB-AF

Intel® Xeon® W-11155MRE (4-Core, 2.4/4.4 GHz, 8 MB, 16 EU, ECC, 24/7, RT, eTEMP, 35/45 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions I-Temp
 

TQMx110EB-AG

Intel® Xeon® W-11865MLE (8-Core, 1.5/4.5 GHz, 24 MB, 32 EU, ECC, 24/7, RT, 25 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions C-Temp
 

TQMx110EB-AH

Intel® Xeon® W-11555MLE (6-Core, 1.9/4.4 GHz, 12 MB, 32 EU, ECC, 24/7, RT, 25 W TDP),  RM590E,DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions C-Temp
 

TQMx110EB-AI

Intel® Xeon® W-11155MLE (4-Core, 1.8/3.1 GHz, 8 MB, 16 EU, ECC, 24/7, RT, 25 W TDP), RM590E, DDR4-ECC-Support, no onboard SSD, TPM 2.0, industrial use conditions C-Temp
 

Further information

 

Application examples

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