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Comprehensive inspection and testing, along with quality monitoring throughout the entire process, enable us to guarantee the best quality and functionality for our customers’ components – with optimal inspection depth and a balanced cost-benefit ratio. We work with you to derive the optimal testing methods, and define testing aspects (also known as DFX aspects) early on during the production phase.
We take the specific requirements of the respective industry into consideration, as well as annual volume, product lifecycles and the complexity of the components. This save you costs and avoids problems in the subsequent manufacturing process.
All test procedures are of course recorded in our traceability system.
AOI (automated optical inspection) describes systems that use image processing to detect soldering errors on components. The process is a further development of machine vision.
We offer automatic optical inspection for Solder Paste Inspection (SPI), SMD assembly and soldering, and THT.
By means of manual and automatic X-ray inspection, solder joints, components and printed circuit boards are carried out as required during series transition, randomly during series production or even for the complete series. High-resolution X-ray systems with tomography function enable optimum defect detection and analysis.
Checks to ensure proper processing and in some cases the parameters and functions of the components. No product-specific test adapter is required. Essentially equivalent to an MDA (Manufacturing Defect Analyzer) for detecting manufacturing defects.
Seven of these test systems at different locations, together with other test procedures, ensure high processing quality at TQ. Here TQ uses the powerful systems of the manufacturer SPEA, which ensure precise measurements integrated in a multi-process platform and now also enable an "optical test" of LEDS.
This testing method contacts every accessible circuit node on the test object via a needle bed. This happens on our systems with approx. 500 measurements per second at up to 2000 measuring points.
We use this to test the correct assembly of components and, as far as possible, their characteristic values. The test also tests component functionalities for complex digital components. The In-Circuit Test also includes the onboard programming of memory devices. 20 of these powerful test systems at different locations, together with other test procedures, ensure high processing quality at TQ.
The functional test focuses on the functionality of the DUT and is created in close coordination with the development department (TQ-internal or customer).
Where possible, TQ standard functional test systems are used, of which there are well over 100 at TQ.
In addition, the operation, through the functional test system provided by the customer, is multiple practice at TQ.
The boundary-scan test can be used as an independent test procedure, but can also be integrated as a component of other test procedures, e.g. functional test. A BST is preferably used on assemblies where high component packing densities can be found.
In the boundary-scan test we distinguish between:
A module is tested with the aid of "electronic nails". They are located at the pins of the boundary-scan-capable components via which digital signals are applied and measured. Circuits can also be programmed via the BST. In addition, several modules can be tested or programmed simultaneously in the BST.
Depending on requirements and customer wishes, we carry out additional quality assurance burn-in and run-in tests. These can be static or dynamic (with constant or variable temperatures) or active or passive (with or without operation of the module), depending on the requirements.
Burn-in and run-in testing can identify weak points and batch problems, reduce early failures and increase reliability in the field.
In the Highly Accelerated Life Test (HALT), assemblies and devices are subjected to increased thermal and mechanical stress with extreme temperatures, strong temperature gradients and random vibration in order to identify and optimize weak points in the design and in the components used during development and product qualification.
The load limits (destruction limits) obtained with HALT can then be used in series with a defined safety margin to carry out production-accompanying HASS tests (Highly Accelerated Stress Screening). Batch problems with individual components or processing defects can be detected.