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COM-HPC Mini Powerful embedded technology in compact format
COM-HPC Mini sets the new standard for high-performance embedded systems in space-constrained environments. With the TQMxCU1-HPCM, TQ introduces its first powerful module based on Intel® Core™ Ultra processors – ideal for AI applications, video streaming, industrial imaging, and space-critical edge systems. Experience maximum performance in minimum space – designed to meet the demands of tomorrow.
Why COM-HPC Mini? Key advantages of the form factor
The new industry standard in detail
- Standardized according to COM-HPC Specification 1.2
- Only 95 × 70 mm – ideal for space-constrained designs
- Optimized for high-end processors (supports up to 107 W TDP)
- 400-pin high-performance connector
- Maximum interface density in minimal space – supporting high-speed I/O such as PCIe Gen5, USB4, and up to 10 Gbit Ethernet
- Soldered memory for enhanced shock and vibration resistance and superior thermal coupling
PICMG on COM-HPC Mini
TQ is the first company to offer a COM-HPC Mini module based on Intel® Core™ Ultra processors. «
In this video, Brandon Lewis, Marketing Officer at PICMG, explains the key benefits of the COM-HPC Mini standard and how TQ’s embedded module TQMxCU1-HPCM, combines two powerful new technologies in one compact solution.
PICMG is an international industry consortium that defines open standards for modular computing architectures, such as COM-HPC and COM Express.
TQMxCU1-HPCM: Optimally tuned - latest processor technology in a new form factor
Intel® Core™ Ultra processors ("Meteor Lake-U/H") offer impressive graphics and AI performance in combination with the latest Intel hybrid technology for innovative edge applications. Unlock the potential: In conjunction with the new COM-HPC® Mini standard, the numerous high-speed interfaces can be optimally utilized.
- Intel® Core™ Ultra 5 and Intel® Core™ Ultra 7 in 15 W "Ultra-Low-Power" or 28 W "High-Performance" version
- 400-pin high-speed connector with future-proof pinout for USB 4 / USB-C, PCIe Gen5 and ultra-high-resolution display outputs
- Extremely compact with space savings of 26% compared to COM Express® Compact and 41% compared to COM-HPC® Client (size A)
COM-HPC Mini at a glance
What is COM-HPC Mini?
COM-HPC Mini is a standardized form factor for ultra-compact computer-on-modules that deliver high processing power and a broad range of interfaces.
What are typical application areas for COM-HPC Mini modules?
COM-HPC Mini modules are ideal for compute-intensive, space-constrained applications such as industrial imaging, edge AI, medical technology, robotics, and defense. Mobile applications also benefit from the compact, low-profile design.
How does COM-HPC Mini differ from COM Express?
Compared to COM Express, COM-HPC Mini features a new connector with significantly higher data bandwidth and improved high-speed capabilities (e.g., PCIe Gen5, USB4), an optimized pinout, and is designed to support next-generation energy-efficient high-end processors – all in a smaller footprint.
Our USPs
- Unbeatable long-term availability
- Robustness for all applications
- The most comprehensive range of modules on the market
- A comprehensive design and support of an E²MS manufacturer
- Full design freedom, as all processor functions are fully accessible
- x86 for tough industrial use
