Electronics Manufacturing

AOI (Automated Optical Inspection) refers to systems that use image processing technology to detect and report defects in component soldering. It is an advanced form of machine vision.

We offer automated optical inspection for solder paste printing (Solder Paste Inspection – SPI), SMD assembly and soldering, as well as THT assembly.

Using manual and automated X-ray inspection, solder joints, components, and printed circuit boards are inspected as needed during transfer to series production, on a sample basis alongside series production, or across the entire series. High-resolution X-ray systems with tomography functionality enable optimal defect detection and analysis.

The flying probe test is an adapterless test procedure that can be used particularly flexibly and quickly. Functionally, it corresponds to a Manufacturing Defect Analyzer (MDA) for reliable detection of manufacturing defects. The device under test is contacted via several programmable probes that are precisely guided to the respective test points.

With a total of seven test systems at various locations, flying probe testing makes a significant contribution to TQ’s high manufacturing quality. Powerful systems from the manufacturer SPEA are used, enabling precise measurements within integrated multi-process platforms and additionally supporting optical tests, for example for LEDs.

In in-circuit testing, all accessible circuit nodes of the device under test are contacted via a bed of nails. On our systems, up to 500 measurements per second are performed at up to 2,000 test points.

This allows us to verify the correct assembly of components as well as, where possible, their electrical parameters and functionalities, including complex digital components. In addition, in-circuit testing enables onboard programming of memory devices. A total of 20 high-performance test systems at various locations make a major contribution to TQ’s high manufacturing quality.

The functional test focuses – as the name suggests – on the functionality of the device under test and is created in close coordination with development, either internally at TQ or with the customer.

Where possible, TQ standard functional test systems are used, of which there are well over 100 at TQ.

In addition, the integration and use of customer-specific, provided test systems is also an established part of TQ’s practice.

The Boundary Scan Test (BST) can be used as a standalone test method or integrated into other test procedures, such as functional testing. BST is particularly well suited for assemblies with high component density.

In boundary scan testing, a distinction is made between:

• Interconnection Test – Only the connections between boundary-scan-capable components are tested.
• Cluster Test – Additional components that are not boundary-scan-capable are also included in the test.

Depending on requirements and customer preferences, we perform burn-in and run-in tests for additional quality assurance. Depending on the specific requirements, these tests are carried out statically or dynamically, with constant or variable temperatures, and actively or passively, with or without operation of the assembly.

Burn-in and run-in tests help identify weaknesses and batch-related issues, reduce early failures, and increase reliability in the field.

In Highly Accelerated Life Testing (HALT), assemblies and devices are exposed to increased thermal and mechanical stress, including extreme temperatures, strong temperature gradients, and random vibration, in order to identify and optimize weaknesses in the design and the components used during development and product qualification.

The stress limits identified during HALT, including destructive limits, can then be used in series production with a defined safety margin to perform production-accompanying Highly Accelerated Stress Screening (HASS). This makes it possible to detect batch-related issues in individual components or defects in workmanship.