TQ presents the latest COM Express Compact module
At embedded world 2019, the technology company TQ presents the new COM Express Compact Type 6 module TQMx80UC, which is based on the 8th generation Intel® Core™ Mobile Processors. This module is particularly suitable for industrial controllers, robotics applications, medical devices and point-of-sales. The TQ booth 578 is located in hall 1.
For the TQMx80UC, TQ relies on the Intel Core processor family of the 8th generation (U series). Depending on the required functionality and computing power, several CPU variants (i7, i5, i3, Pentium, Celeron) with two or four cores can be selected. With a thermal power loss of 15 watts TDP, four cores are now available for the first time in this performance class (previously two for the 7th generation U series).
The memory interface is equipped with the fast DDR4-2400 technology. The memory capacity can be selected between 4 and 64 GB depending on the SO-DIMM modules used. Up to nine PCI Express lanes (Gen3; 8 GHz) are available for connecting up to five peripheral devices and can be flexibly configured in the BIOS. For the first time, the new USB 3.1 Gen2 standard is supported, which allows transfer rates of up to 10 Gbit/s. Four high-speed interfaces are available for this purpose. In addition, eMMC Flash in sizes between 8 and 128 GByte is available for the first time on the module.
The COM Express Compact Module TQMx80UC with its dimensions of 95 x 95 mm and Type 6 pinout conforms to PICMG COM.0 R3.0 and is supported by the new TQ mainboard MB-COME6-3. Together with a 11 mm high heatspreader and a heatsink, this results in an ideal evaluation platform.
At the TQ booth 578 in hall 1 a demonstration application will be shown, which illustrates the increased computing power of the four-core platform to visitors.
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