The technology company TQ is now offering the new TQMxE39S SMARC 2.0 module with the latest-generation Intel® Atom™ E3900 processors (codename: Apollo Lake). The technical characteristics of the module have been optimized for harsh and rugged applications. The combination of high-speed RAM with 2 to 8 GB of dual-channel LPDDR4 and available eMMCs ranging from 4 to 64 GB for an expanded temperature range, optimized cooling solutions and an optional conformal coating stake out new potential applications for the module under extreme environmental conditions.
The technology company TQ is now offering the new TQMxE39S SMARC 2.0 module with the latest-generation Intel® Atom™ E3900 processors (codename: Apollo Lake). The technical characteristics of the module have been optimized for harsh and rugged applications. The combination of high-speed RAM with 2 to 8 GB of dual-channel LPDDR4 and available eMMCs ranging from 4 to 64 GB for an expanded temperature range, optimized cooling solutions and an optional conformal coating stake out new potential applications for the module under extreme environmental conditions.
The best possible utilization of the display interfaces provided by the processor such as Dual Channel LVDS or Embedded DisplayPort 1.4 (configuration options), HDMI 1.4b and DP 1.2a, a GbE port, which can be expanded to two ports using the available MB-SMARC-1 carrier, four USB 2.0 ports, two USB 3.0 ports and up to 4 PCIe lanes offer a broad bandwidth for additional functions on the carrier board. Equipped with the newest Intel® graphics processor core, 4K screen resolution for three different screens, 3-D video processing and significantly increased video encoding/‑decoding performance are possible.
Two native MIPI-CSI camera interfaces and a variety of new functions form the basis for image capture applications and IoT solutions. The integrated board controller supports thermal management, a multi-stage watchdog, "Green ECO-Off" for minimum standby consumption and provides customized configuration options (flexiCFG) yielding a high degree of flexibility. In this way, the TQMxE39S is suitable as a SMARC 2.0 module for mobile, battery-operated, low-profile applications for an expanded temperature range.
As a SMARC 2.0 module, the TQMxE39S is therefore suitable for mobile, battery-powered low-profile applications in the extended temperature range.
SMARC, IIoT, ARM, Obsolescence Management and more! electronica 2018 trade fair highlights by the technology company TQ extend from new ARM-based solutions, x86 solutions and a SMARC main board that combines the ARM and x86 worlds to a presentation on Obsolescence Management. Visitors to booth B5.201 in Hall B5 can look forward to these and other highlights from the embedded and E²MS fields.
SMARC, IIoT, ARM, Obsolescence Management and more!
electronica 2018 trade fair highlights by the technology company TQ extend from new ARM-based solutions, x86 solutions and a SMARC main board that combines the ARM and x86 worlds to a presentation on Obsolescence Management. Visitors to booth B5.201 in Hall B5 can look forward to these and other highlights from the embedded and E²MS fields.
ARM
Thanks to its numerous interfaces, the MBa6ULxL provides an optimal basis for simple control and HMI tasks. The Single Board Computer (SBC) is based on an LGA module in which all i.MX6UL and i.MX6ULL CPU devices can be used to meet specific requirements. There is also a housing solution. The SBC is an ideal platform for gateways and data loggers in combination with various radio-based solutions such as WiFi, LoRaWAN and UMTS.
The i.MX8 CPU series with its three CPU families is the optimal basis for four module designs. TQ develops embedded modules with the i.MX8X, i.MX8M and i.MX8. Many expansion levels are available for projects with the core architectures from Cortex-A35 to Cortex-A72 – especially for the areas of medicine, entertainment and control tasks. Based on the i.MX8X, TQ is showing two modules with different form factors (SMARC and the TQ standard with one hundred percent availability of all signal pins).
In the future, TQ will be offering a TSN and OPC-UA solution in the form of the familiar TQMa57xx with the AM57xx processor family which is based on a Cortex-A15 from Texas Instruments. This means that the module can be used for real-time applications in complex controllers – for which both of these new standards are growing in importance.
TQ is also showing new modules and platforms in the QorIQ Layerscape product family. Besides general control tasks, these solutions are especially used in projects in the networking field in which high data transmission rates are required. TQ offers modules with up to eight 64-bit cores, 10 Gbit Ethernet interfaces and a 4K graphic interface in conjunction with TSN. They can be used to implement innovative routers, gateways and controllers for the digitalization era. In addition, visitors can already see the first platforms and system solutions.
Another TQ highlight is a latest-generation SMARC mainboard which combines the x86 and ARM worlds. It enables the use of both Intel and ARM modules on one carrier board without requiring modifications.
x86
TQ has completed its product range of the latest standard modules to be based on the Intel Atom E3900 series. All form factors are supported: from the COM Express Compact (TQMxE39C1/C2) and COM Express Mini (TQMxE39M) to the new SMARC 2.0 (TQMxE39S). The series includes variants with soldered memory and SO-DIMMs (TQMxE39C1). The E3900 SoC series product family represents the latest Intel Atom generation, which supports up to three independent screens, each with a resolution of up to 4K/UHD. The embedded DisplayPort signal for internal displays supports screen resolutions of up to 3840 x 2160 pixels at a refresh rate of 60Hz. For external monitors, DisplayPort (4096x2160@60Hz) and HDMI (3840x2160@30Hz) are available. LVDS monitors are generally supported up to Full-HD resolution (1920x1080@60Hz) via an intermediate eDP-to-LVDS bridge.
Complete systems & IIoT
At the TQ booth, visitors will have the opportunity to experience the wide range of potential uses of TQ-Box PCs on the Industry 4.0 Factory Floor. This demo shows the interplay of control system, visualization, computer vision and edge-to-cloud.
Equipped with Intel Atom processors of the E3800 (Bay Trail-I) and E3900 (Apollo Lake-I) series, the Box PCs of the MBox family offer high computing power and low power dissipation. Their rugged construction and suitability for 24/7 continuous operation creates the foundation for reliable and failsafe applications.
The high performance values and comprehensive software compatibility of the two to four gigabit Ethernet interfaces make them suitable for use as intelligent gateways and industrial firewalls. New industrial standards like OPC UA TSN are supported here; this is an important prerequisite for covering Industry 4.0 requirements in a way that is universal and manufacturer-independent.
Challenging visualization tasks can be performed with graphic performance and resolutions of up to 4K UHD for two displays. Applications in the area of computer vision can be implemented efficiently with supplemental options like the Intel Myriad 2 Video Processing Unit (VPU).
Obsolescence Management by TQ
TQ will also be participating in Obsolescence Day on Tuesday, November 13 at the electronica show. The director for Obsolescence Management at TQ, Ms. Stefanie Kölbl, will be giving a presentation in Hall C2 at 4:00 pm titled "Obsolescence Management – Solution to Secure the Long-term Availability" as part of the forum.
Unless otherwise stated, TQ-Systems GmbH is the copyright holder of the images used in this press release. These pictures can be used free of charge if the author is named.