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Glossary

You do not understand a technical term or need a reliable definition?
In the glossary of the TQ-Group, you will find all the relevant explanations of commonly used and explanatory terms in the electronics sector.

  • AOI

    Automatische optische Inspektion

    Device with high-performance sensors and camera systems for visible inspection of modules.

  • ARM Cortex™-A9

    Microcontroller based on ARM Architecture
    The ARM Cortex ™ -A9 MPCore is a 32-bit multicore processor with up to 4 cache-coherent Cortex-A9 cores, each implementing the ARMv7 instruction set. (Source: Wikipedia)

  • BGA

    Ball Grid Array

    Active component with flat connection grid and solder balls

  • BST

    Boundary-Scan-Test

    Check an assembly using boundary scan-capable components on this assembly. One differentiates:

    • Interconnection test: with several Boundary-Scan-capable blocks on the module Checking the existing connections between these blocks
    • Cluster test: Checking the non-Boundary-Scan-capable blocks on the module using the boundary-scan-capable blocks
  • CEM

    Contract Electronic Manufacturing

    Contract manufacturing of electronic assemblies and systems (see also EMS)

  • COM

    Computer-on-module

    Embedded modules are ready-to-use microcontroller modules that provide all the functionality of a small footprint computer. TQ offers embedded modules (TQ mini-modules) with Freescale, Intel, AMD, VIA or Infineon processors (Power Architecture ™, ARM, ColdFire ®, x86 and C166).

  • DFL

    Design for Longevity

    Longevity optimized design

  • DfM

    Design for manufacturing

    DfM stands for "Design for Manufacturing" and means that an assembly or a device is consistently designed and constructed so that it can be manufactured optimally from a cost and quality perspective.

    In particular, the following aspects should be considered in the "Design for Manufacturing":

    • High common parts (-> low set-up time, faster assembly, lower costs)
    • Optimal PCB layout with regard to the assembly and soldering processes
    • As few as possible different manufacturing and assembly steps and processes
    • Easy to install mechanics
    • Coordinated tolerance chains
    • No unnecessarily tight tolerances
  • DFR

    Design for Reliability

    DFR stands for "Design for Reliability" and means that an assembly or device is consistently designed and engineered to be highly reliable, low in failure rate, and long-lasting.

    In particular, the following aspects should be considered in the "Design for Reliability":

    • System, product, design and process FMEA
    • Redundant design, parallel / serial connection
    • Increased safety margins/specification reserves of components - "Factor-2-Design"
    • Use of proven, robust technologies
      • PCB structures, number of layers, TG and TD reserves
      • Semiconductor structures
      • Capacitors, chokes: structure sizes
      • NOR instead of NAND Flash, Single Level Cell (SLC) instead of Multi-Level Cell (MLC)
    • Avoiding unnecessary complexity in hardware and software
  • DFS

    Design for Service

    DFS stands for "Design for Service" and means that an assembly or a device is service-friendly designed and constructed.

    In particular, the following aspects should be considered in the "Design for Service":

    • High equal parts (spare parts stock)
    • Long-term component availability
    • Modular construction
    • Good testability (DFT)
    • Good disassembly
    • Good accessibility of assemblies and components
  • DfT

    Design for Testability

    DfT stands for "Design for Testability" and means that an assembly or a device is consistently designed and constructed in such a way that it can be optimally tested from a cost and quality perspective.

    The following aspects should be considered and implemented in the "Design for Testability", if possible and appropriate:

    • AOI-compliant PCB layout
    • Test Points for FPT or ICT (Flying Probe Test or In-Circuit Test)
    • ICT-compliant circuit design (especially for digital ICT)
    • BST functionality (Boundary Scan Test)
    • Integrated function test functions
    • Integrated self-test functionality
    • Multi-stage testing process with tests that are as close to the production process as possible
  • DTC/DFC

    Design to Cost / Design for Cost effectivity

    DTC / DFC stands for "Design to Cost / Design for Cost-Effectiveness": cost-optimized design

    In particular, the following aspects should be considered in the "Design to Cost":

    • Cost-optimized component selection
    • Ensuring sufficient long-term component availability
    • Bundling at component and manufacturer level (volume effect)
    • Use of appropriate, mature technologies
    • Avoidance of unnecessary requirements and unnecessarily tight tolerance
    • Integrated supply chain management (low logistics costs)
    • Implementation of DFM (low production and assembly costs with high quality)
    • Implementation DFT (low test costs with high quality)
    • Implementation DFl & DFR (low warranty costs)
    • Implementation of DFS (low service costs)
    • Obsolescence Management
  • EBB

    Embedded Building Blocks

    Intel® initiative to promote products that meet both consumer and industrial needs and bring the benefits of both. TQ offers COMSys, a modular embedded PC platform, as part of the Embedded Building Blocks initiative on COM Express.

  • Embedded Systems

    System using embedded modules, such as TQ Industrial PCs.

  • EMC

    Electromagnetic compatibility

    Condition in which technical devices do not influence each other undesirably.

  • EOL

    End of life

    Articles that are no longer manufactured and no longer available.

  • FT

    Functional test

    Checking the function of individual sections as well as the complete module (similar to their subsequent conditions of use).

  • FPT

    Flying Probe Test

    Checking the correct processing and partly the parameters and function of the components on an assembly.

  • HMI

    Human Machine Interface

    People use machines via human-machine interfaces. HMIs are, for example, the computer keyboard or a steering wheel.

  • ICT

    In-Circuit-Test

    Checking the correct processing and partly the parameters and function of the components on an assembly.

  • IPC

    Industrie-PC

    Computers designed for tough industrial use. TQ Industrial PCs are characterized by:

    • High robustness
    • Long availability
    • Extended temperature range
    • Low energy consumption
    • Passive cooling
    • Designed for strong vibration
    • High modularity
    • High functionality
  • Layout

    Arrangement of components and conductors in or on an electronic assembly (PCB unbundling).

  • NRND

    Not Recommended for New Designs

    Not Recommended for New Designs

  • ODM

    Original Design Manufacturer

    Company that develops and manufactures products on behalf of customers. The product is distributed under the brand name of the customer.

    The TQ-Group's ODM offer includes:

    • Customized products
    • From the concept to the finished product
    • Based on the TQ solution kit (hardware, software, mechanics)
    • Complete Product Life Cycle Management (PLM)
  • OEM

    Original Equipment Manufacturer

    Manufacturer of components that are integrated unaltered in devices from other manufacturers.

    The OEM offer of the TQ-Group includes the following standard products:

    • Modules (TQ-Mini-modules)
    • Baseboards
    • Interface modules
    • Control components
    • Controls and
    • Industrial PCs
  • OM

    Obsolescence Management

    Obsolescence Management implements concepts for the long-term supply of electronic assemblies. The obsolescence management strategy developed by TQ offers optimal protection against obsolete ("no longer produced") components, complex redesigns, insecure sources and expensive brokerware.

  • Outsourcing

    Outsourcing of company tasks to service companies

  • P2020

    QorIQ processor

    QorIQ dual core communication processor up to 1.2 GHz from Freescale Semiconductor.

  • PCN

    Product Change Notification

    Manufacturer information on product changes

  • PLM

    Product Lifecycle Management

    Product lifecycle management controls all processes around a product throughout its lifetime.

  • QorIQ™

    Mikrocontroller basierend auf Power Architecture

    QorIQ is the name of a series of microcontrollers based on Freescale Semiconductor's Power Architecture. It consists of the five product families P1-P5, all of which are based on the e500 processor core or its successors. They are used in embedded systems, especially as network devices (routers, switches). (Source: Wikipedia)

  • Rapid Prototyping

    Method for producing pattern assemblies in a very short time.

  • RoHS

    Restriction of hazardous substances

    EC Directive 2002/95 / EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment.

  • Smart Metering

    Solutions for intelligent electricity metering, such as those offered by IEQualize.

  • SMD

    Surface Mounted Device

    Surface Mounted Device

  • SMT

    Surface Mount Technology

    PCB assembly on the PCB surface

  • Target Costing

    Target Costing

  • THT

    Through Hole Technology

    With through hole technology, printed circuit boards are provided with holes in which the wire connections of the components and components are inserted.

  • Traceability

    Traceability

    Traceability of a product with regard to:

    • manufacturing
    • composition
    • processing
    • storage
    • consumption
    • (in accordance with DIN EN ISO 8402)
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