The COM Express® Compact Module TQMxE40C2 is available with Intel® Atom™, Pentium® and Celeron® processors of the 6th generation (10 nm process technology) and impresses with increased CPU computing power, fast, pluggable SO-DIMM DDR4 memory with a capacity of up to 64 GByte, Inband ECC (optional) and significantly improved performance values in the area of graphics and image processing. Due to the COM Express® Compact design (95 mm x 95 mm) and the low power dissipation (4.5 - 12 Watt TDP), the module opens up new possibilities in industrial automation, transportation, power generation and transmission, medical technology and many other fields of application, especially in the extended temperature range of -40°C to +85°C. Two USB 3.1 Gen 2 ports (2x 10 Gbit/s) as well as, for the first time, 8 PCIe Gen 3 lanes (8 GT/s), offer a high bandwidth for extensions and additional functions on the carrier board. Equipped with the latest Intel graphics processor, up to 3 parallel displays with up to 4K screen resolution are supported.
Virtualization and new features like Time Coordinated Computing offer best conditions for real-time applications and time synchronous IOT solutions. The optionally available eMMC flash memory (up to 256 GByte) as well as assembly options for either embedded DisplayPort (eDP) or LVDS offer great flexibility. The integrated board controller supports thermal management, a multi-stage watchdog, "Green ECO-Off" for minimum standby consumption and offers customer-specific configuration options (flexiCFG) for a high degree of flexibility. Combined with the optimized cooling solutions, the TQMxE40C2 with pluggable SO-DIMM memory that can be expanded in the field is suitable for applications with the largest possible memory requirements (up to 64 GB).