COM Express® One standard, maximum flexibility.

COM Express® (COMe) is an established computer-on-module approach defined by the PICMG as an international standardization body. The COM Express® specification creates a resilient basis for demanding embedded applications, for example in industrial automation, transportation or aviation.

As a com express standard, COM Express® is designed for modern high-speed interfaces, including PCI Express, USB 3.x, SATA, high-speed Ethernet and high-resolution graphics and video connections. Thanks to different form factors and defined pinouts, a COM Express® module can be specifically adapted to device requirements.

How to choose the right form factor

The choice of form factor primarily determines how well your system design fits the available space, IO requirements and thermal budget.

• Size and mechanical specifications: If the device needs to be extremely compact, COM Express Mini is often the first option. For more board space and greater layout freedom, Compact or Basic are possible options.
   
• Interface requirements and expandability: The more high-speed IO, additional controllers or expansions are planned on the carrier board, the more worthwhile a larger form factor is. In this way, functions can be clearly separated and boards can be maintained in the long term.
   
• Thermal and computing power: The thermal concept is often the practical framework for the CPU selection. Compact and Basic are typically suitable for higher performance requirements, while Mini is often used in very efficient designs.

COM Express® Mini, Type 10

For low-power (CPU typ. 5...12 W TDP) and ultra-compact integration

COM Express® Compact, Type 6

For rich IO and scalability from entry-level up to high-performance at moderate power (CPU: typ. 5...15 W TDP)

COM Express® Basic, Type 6

High-end computing power with high power efficiency (CPU: typ. 25/35/45 W TDP)