Embedded Modul TQMxCU3-C6 COM Express® Compact Type 6 Module with Intel® Core™ Ultra Series 3 Processors

Codename: Panther Lake

Product image TQMxCU3-C6 with coming soon button
  • Intel® Core™ Ultra 9, Intel® Core™ Ultra 7, and Intel® Core™ Ultra 5
  • New chiplet technology for optimized power balance and improved power efficiency
  • High bandwidth with up to 16 PCIe lanes
  • Advanced graphics capabilities: up to four simultaneous high-resolution display outputs with brilliant graphics performance and AI capabilities
  • 2.5 Gigabit Ethernet, ultra-high-speed PCIe and I/O
  • Embedded and industrial use conditions with real-time support and 24/7 operation
  • Extended temperature range options (down to -40°C)
The TQMxCU3-C6 is a powerful COM Express® Compact Type 6 embedded module based on the latest Intel® Core™ Ultra Series 3 processors. It is designed specifically for demanding edge computing and AI applications, combining high computing performance with optimized energy efficiency. Intel’s modern chiplet architecture and hybrid technology enable configurations with up to 16 CPU cores. The CPU is complemented by integrated Intel® graphics and a dedicated NPU, which accelerates AI workloads directly on the system.
For high data throughput, the module supports fast DDR5 memory as well as modern high-speed interfaces such as PCIe Gen4, USB 3.2 and 2.5 Gigabit Ethernet. The integrated graphics also support up to four independent high-resolution displays, making the module well suited for demanding visualization and HMI applications. Overall, the TQMxCU3-HPCM provides a compact and powerful platform for industrial, medical, security-related and communication applications where computing performance, graphics capabilities and AI acceleration are required in a space-saving form factor.

CPU/Processor data

CPU/Processor:
  • Intel® Core™ Ultra 7 processor 365 (4/0/4, 4,7GHz, 12M, 4Xe, 12 PCIe, vPro)
  • Intel® Core™ Ultra 7 processor 355 (4/0/4, 4,6GHz, 12M, 4Xe, 12 PCIe)
  • Intel® Core™ Ultra 5 processor 335 (4/0/4, 4,5GHz, 12M, 4Xe, 12 PCIe, vPro)
  • Intel® Core™ Ultra 5 processor 325 (4/0/4, 4,4GHz, 12M, 4Xe, 12 PCIe)
  • Intel® Core™ Ultra 5 processor 332 (2/0/4, 4,3GHz, 12M, 2Xe, 12 PCIe, vPro)
  • Intel® Core™ Ultra 5 processor 322 (2/0/4, 4,3GHz, 12M, 2Xe, 12 PCIe)
  • Intel® Core™ Ultra 9 processor 386H (4/8/4, 4,8GHz, 18M, 4Xe, 20 PCIe, vPro)
  • Intel® Core™ Ultra 7 processor 366H( 4/8/4, 4,7GHz, 18M, 4Xe, 20 PCIe, vPro)
  • Intel® Core™ Ultra 7 processor 356H (4/8/4, 4,6GHz, 18M, 4Xe, 20 PCIe)
  • Intel® Core™ Ultra 5 processor 336H (4/4/4, 4,5GHz, 18M, 4Xe, 20 PCIe, vPro)
  • Intel® Core™ Ultra X9 processor 388H (4/8/4, 5,0GHz, 18M, 12Xe, 12 PCIe, vPro)
  • Intel® Core™ Ultra X7 processor 358HR (4/8/4, 18M, 12Xe, 12 PCIe, vPro, FuSa)
  • Intel® Core™ Ultra X7 processor 368H (4/8/4, 4,9GHz, 18M, 12Xe, 12 PCIe, vPro)
  • Intel® Core™ Ultra X7 processor 358H (4/8/4, 4,7GHz, 18M, 12Xe, 12 PCIe)
  • Intel® Core™ Ultra 5 processor 338H (4/4/4, 4,6GHz, 18M, 10Xe, 12 PCIe, vPro)
  • Intel® Core™ Ultra 7 processor 365RE (4/0/4, 12M, 4Xe, 20 PCIe, vPro, I-Temp, FuSa)
  • Intel® Core™ Ultra 5 processor 335RE (4/0/4, 12M, 4Xe, 20 PCIe, vPro, I-Temp, FuSa)
  • Intel® Core™ Ultra 7 processor 366HRE (4/8/4, 18M, 4Xe, 20 PCIe, vPro, I-Temp, FuSa)
  • Intel® Core™ Ultra 5 processor 336HRE (4/4/4, 18M, 4Xe, 20 PCIe, vPro, I-Temp, FuSa)

Memory

LPDDR5x:
  • 16 / 32 / 64 GB, Dual Channel

Graphics

Display:
  • up to 3x DDI (DP 1.4b / HDMI 2.1) (up to 8K)
  • 1x dual channel LVDS or eDP (1.4b) (up to 4K)
  • Up to 4 independent display outputs

Communication interfaces

Ethernet:
  • 1x 2.5 Gigabit Ethernet (Intel i226)
USB:
  • up to 4x USB 3.2 Gen2 (up to 10 Gb/s)
  • 8x USB 2.0

Other interfaces

MIPI:
  • MIPI-CSI (1x 2 lanes / 1x4 lanes) on extra pin connector (configuration option)
UART:
  • 2x UART
PCIe:
  • 4x PCIe Gen4 (up to 16 Gb/s per Lane) (div. configurations)
  • 8x PCIe (PEG, up to 16 Gb/s per Lane) (x8 or x4/ x4)
LPC:
  • 1x LPC/eSPI
I2C:
  • 1x I2C
SMBus:
  • 1x SMBus
SPI:
  • 1x SPI (for external UEFI BIOS flash)
GPIO:
  • 8x GPIO through TQ-flexiCFG

Other functions

TPM:
  • TPM 2.0 (SLB9672) (configuration option)
Board Controller:
  • TQMx86 board controller with watchdog and TQ-flexiCFG<br />Temperature monitor and fan control

General data/basic data

Dimensions:
  • 95 mm x 95 mm
Plug-in System:
  • COM Express® Compact, type 6
Temperature range:
  • Standard temperature: 0°C…+60°C
  • Extended temperature: -40°C … +85°C (H484 ET and H404E ET CPU versions)
Power supply:
  • 8.5 ... 20 V, 3 V Battery for RTC
Power consumption:
  • typ. 12 - 45 W / max. 90 W (preliminary)

OS-Support

OS Support:
  • Windows 11 IoT Enterprise LTSC
  • BSP for Linux (Yocto/ Ubuntu)

User Manual TQMxCU3-C6 (4 MB, pdf)

TQMxCU3-C6-AA

Intel® Core™ Ultra 5 325 (4P+0E+4LPE, up to 4.4 GHz, 12 MB, 4Xe, 12 PCIe), 16GB LPDDR5, 2xDP++, eDP, TPM 2.0, C-Temp.

TQMxCU3-C6-AB

Intel® Core™ Ultra 7 356H (4P+8E+4LPE, up to 4.6 GHz, 18 MB, 4Xe, 20 PCIe), 16GB LPDDR5, 2xDP++, eDP, TPM 2.0, C-Temp.

Support

Comprehensive information from the software area such as BSP documentation, tutorials, FAQs, sample codes and are available in our Support Wiki.

 

Application examples

3265,33

Our USPs

  • Unbeatable long-term availability
  • Robustness for all applications
  • The most comprehensive range of modules on the market
  • A comprehensive design and support of an E²MS manufacturer
  • Full design freedom, as all processor functions are fully accessible

Embedded downloads

Current downloads such as product data sheets, manuals, application notes as well as software and drivers can be found in the Download Center.

 

TQ-Embedded news

All the latest news about TQ-Embedded and our products as well as press releases can be found in our news overview.