Embedded Modul TQMxCU3-HPCM COM-HPC® Mini Module with Intel® Core™ Ultra Processors (Series 3)

The COM-HPC Mini module TQMxCU3-HPCM, based on Intel® Core™ Ultra Series 3 processors, delivers a new level of performance for AI-driven edge systems. These processors are designed for data-intensive and latency-critical applications and combine a modern hybrid CPU architecture with a powerful integrated GPU and a next-generation NPU. As a result, industrial, medical, security-related, and communication applications benefit from significantly increased AI performance directly at the edge — without the need for additional accelerators or reliance on the cloud. The energy-efficient architecture of the Core™ Ultra Series 3 also enables compact and thermally optimized system designs. Depending on the application’s performance profile, fanless solutions can be realized.

The TQMxCU3-HPCM provides the full feature set of this new platform via the 400-pin high-speed connector of the COM-HPC Mini standard. With its compact dimensions of 95 mm × 70 mm, it opens up new possibilities for powerful edge solutions in space-constrained environments. The soldered memory placed on the top side ensures optimal thermal coupling of all relevant components and prevents heat buildup within the system. This simplifies integration into custom designs and increases reliability during continuous operation. Overall, the TQMxCU3-HPCM offers a future-proof platform for modern edge AI applications that require high computing performance, efficiency, and robustness in a particularly compact form factor.