TQMxE40M
Intel Atom® x6000E series („Elkhart Lake“) / soldered LPDDR4
The COM Express® specification defines a family of Computer-on-Module (COM) standards appropriate for a wide range of applications, including the most demanding transportation and aerospace markets. It is designed for the latest chip sets and serial signaling protocols, including PCI Express Gen 3, high-speed Ethernet, SATA, USB 3.x, and high resolution video interfaces. The COM Express® standard, which is defined by PICMG, is a very stable standard and covers various board dimensions and pin assignments. The most commonly used versions at a glance.
For low-power (CPU typ. 5...12 W TDP) and ultra-compact integration
For rich IO and scalability from entry-level up to high-performance at moderate power (CPU: typ. 5...15 W TDP)
High-end computing power with high power efficiency (CPU: typ. 25/35/45 W TDP)