Embedded Module TQMxE39C1 - with Intel® Atom™ x5/x7 E3900 and soldered DDR3L with ECC support

COM Express® Compact Module with Intel® Atom™ x5/x7 E3900 and soldered DDR3L with ECC support

Key functionalities   

  • Intel® Atom™ x5/x7 E3900 series (“Apollo Lake-I“)

  • Dual/Quad core computing power with up to 2.5 GHz
  • 4/8 GB DDR3L (dual channel), soldered, ECC
  • High-speed interconnected with Gigabit Ethernet,
  • 8x USB (3.0 / 2.0) and up to 4 PCIe lanes
  • Triple display support (up to 4K UHD) and eDP/LVDS
  • Up to 64 GB eMMC Flash, soldered
  • Extended temperature support
  • Watchdog und thermal management
  • Highest reliability, 24/7 certified
  • Conformal coating (on request) and optimized coolingsolutions for ruggedized applications
Logo Embedded Module TQMxE39C1
Embedded Module TQMxE39C1: COM Express® Compact Module with Intel® Atom™
x5/x7 E3900 and soldered DDR3L with ECC support


The TQ module TQMxE39C1 is based on the latest generation of Intel® Atom™ processors. It achieves a new level of compute performance, security and media processing performance in a very compact form factor to empower real-time computing, industrial automation, digital surveillance, aviation, medical, retail and more. The module corresponds to the international established PICMG standard COM Express® Compact (COM.0 R2.1) with type 6 pinout. With the latest Intel®

graphics processor integrated the module delivers 4K high Resolution graphics output, immersive 3D processing and also greatly increased video encode and playback performance. Time coordinated computing capabilities enable time synchronized processes within IoT Networks and industrial control applications. Onboard eMMC up to 64 GB and the option for LVDS or native eDP enable flexibility and reduce overall BOM cost. Combined with options on request like conformal coating and optimized cooling solutions the TQMxE39C1 fits also perfectly into ruggedized applications.




Ordering information

Ordering information

TQMxE39C1-AA (“Premium“)

Intel Atom x7-E3950 (4x 1.6/2.0GHz, 2MB Cache, 12W TDP),

8GB DDR3L, ECC, LVDS, 0GB eMMC, SDCard, Industrial-Temp. -40..+85°C

Request price information

TQMxE39C1-AB (“Mainstream“)

Intel Atom x5-E3940 (4x 1.6/1.8GHz, 2MB Cache, 9.5W TDP),

8GB DDR3L, ECC, LVDS, 0GB eMMC, SDCard, Industrial-Temp. -40..+85°C

Request price information

TQMxE39C1-AC (“Entry“)

Intel Atom x5-E3930 (2x 1.3/1.8GHz, 2MB Cache, 6.5W TDP),

4GB DDR3L, ECC, eDP, 0GB eMMC, SDCard, Industrial-Temp. -40..+85°C

Request price information


Weitere Konfigurationen auf Anfrage

  • CPU
  • Speicher (DDR3L / eMMC)
  • TPM
  • LVDS/eDP
  • SDCard/GPIO
  • Temperaturbereich
  • Kundenspezifisches BIOS
  • Lackierung / Feuchtigkeitsschutz
Request price information



CPU: Intel® Atom™ x5/x7 E3900 („Apollo Lake-I“)
CPU frequency: Atom™ x5-E3930 2x1.8 GHz, 6.5 W
Atom™ x5-E3940 4x1.8 GHz, 9.5 W
Atom™ x7-E3950 4x2.0 GHz, 12 W


DDR3L-SDRAM: 4/8 GB ECC, Dual Channel, ECC
EEPROM: 32 kbit (24LC32)
SD Card: 1x SD card interface / optional 8x GPIO (multiplexed)

System interfaces

Gigabit Ethernet: 1x Gigabit Ethernet (Intel® i210)
(external IEEE1588 sync optional through TQ flexiCFG)
I²C: 1x I²C, (second I²C optional) (Master/Slave capable)
SATA: 2x SATA 3.0 (up to 6Gb/s), eSATA capable
Serial interfaces: 2x Serial Port (Rx/Tx, Legacy compatible, 4-wire optional through TQ flexiCFG)
SPI: 1x SPI (for external uEFI BIOS flash)
USB: 3x USB 3.0
5x USB 2.0

Other interfaces & busses

Audio Interface: 1x Intel® HD Audio (HDA)
LPC: 1x LPC Bus
PCIe: 4x PCIe 2.0 (up to 5Gb/s)
SMBus: 1x SMBus

Security Components

TPM : Optional: SLB9660 TPM 1.2, alternatively SLB9665 TPM 2.0


Graphic interfaces: 2x Digital Display Interface (DDI)
für DP 1.2a, HDMI 1.4b
1x eDP1.4/ Dual Channel LVDS


Dimensions: COM Express™ Compact, Type 6, 95 mm x 95 mm
Board-Controller: TQMx86 board-controller with Watchdog and TQ flexiCFG
Power: typ. 3 - 8 W / max. 14 W
(Green ECO-Off: < 0,1W)
Power supply: 4,75 V - 20 V
4,75 V - 20 V standby (optional)
3 V battery
Supervisor: Hardware monitor
Ambient conditions: Extended temperature: -40°C…+85°C



User's Manual MB-COME6-1

User's Manual for the COM Express® mainboard MB-COME6-1.

(MB-COME6-1.UM.0100_01.pdf, 1.4 MByte, 03.03.2016)


BIOS-Update-USB Stick

Zip Archive with EFI Shell and Update-Tool

(, 343 KByte, 21.04.2016)

BIOS Version for TQMxE39C

[Translate to Englisch:] EFI Version: 5.12.09

BIOS Version: 16.04


MD5SUM: 9E8EBA7D763F1272729AA0BB2B023C60

(, 3.4 MByte, 15.02.2018)

Driver package for TQMxE39x Windows 10 64-bit

The drivers in this package were tested by TQ-Systems.
The package does not contain the latest drivers !

TQ-Systems will not maintain this package.

The latest drivers can be downloaded from the Intel website.



(, 437 MByte, 04.05.2017)


TQMx86 software tools

For uEFI BIOS programming and to adapt / configure setup default values (including multi config),bootlogo, ...

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Support news


BSP Version 0105 with IPU, VPU and GPU Support


Version with Kernel 3.12


CAN, RS485, audio & minor improvements / bugfixes

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