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Embedded Module TQMx70EB - with Intel® Core™ i3/i5/i7 7000E (Generation 7)

COM Express® Basic Modul (Type 6)

Key functionalities   

  • Intel® Core™ 7000E series / Intel® Xeon®  E3-15xx v6 series ("Kaby Lake-H") with up to Quad-Core 3.7 GHz / 8 MB cache

  • Impressive graphics performance (Intel® Iris™ Pro 630)
    with hardwarebased 10-bit HEVC and VP9 en-/decoding

  • Intel® Optane™ 3D XPoint SSD support

  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC

  • High bandwidth with up to 24 PCIe Gen. 3 lanes (incl. PCIe x16 PEG port)

  • TQMx86 board controller with flexible customization options (flexiCFG)

  • Mobile Intel® 100 series chipset (CM238)

  • TPM 1.2 / 2.0

  • “Green ECO-Off” (minimum of standby power)

  • Watchdog und thermal management

  • Highest reliability, 24/7 certified

  • Quality Made-in-Germany

Logo Embedded Module TQMx70EB
Embedded Module TQMx70EB: COM Express® Basic Modul (Type 6)

Overview

The TQ module TQMx70EB is designed for high end computing and graphics capabilities.

With Dual-Channel DDR4-2133 support, high bandwidth PCIe, 4x SATA (6 Gb/s) and 4x USB 3.0 the TQMx70EB guarantees best in class system performance. The module can be equipped with 7th Generation Intel® Core™ i7/i5/i3 and Intel® Xeon® E3-15xx v6 processors (Codename Kaby Lake-H). The integrated Intel® GT2 graphics controller supports up to three independent display outputs with up to 4K resolution @ 60 Hz and excellent 3D / rendering performance. 10 bit graphics  encoding/decoding deliver high color fidelity premium content. Latest power and performance optimizing functions like Intel® Turbo Boost Technology 2.0 and Enhanced Intel® SpeedStep Technology enable perfect user experience with moderate power consumption.

 

This high end COM Express® Basic Type 6 module is best suited for high demand medical, gaming and industrial applications.

 

 

 

Ordering information

Ordering information

TQMx70EB-AA (Premium)

Core i7-7820EQ (4x 3.0 / 3.7 GHz, 8M, 45 W / 35 W),
CM238, LVDS, Standard Temp 0..+60°C

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TQMx70EB-AB (Mainstream)

Core i5-7442EQ (4x 2.1 / 2.9 GHz, 6M, 25W),
CM238, LVDS, Standard Temp 0..+60°C

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TQMx70EB-AC (Entry Level)

Core i3-7102E (2x 2.1 GHz, 3MB, 25 W),

CM238, LVDS, Standard Temp 0..+60°C

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TQMxE70EB-AD (Extreme)

Xeon E3-1505L v6 (4x 2.2 GHz / 3.0 GHz, 8M, 25 W),

CM238, LVDS, Standard Temp 0..+60°C

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TQMx70EB

Other configurations on request

  • CPU
  • TPM
  • LVDS/eDP
  • Extended temperature range (screening)
  • Custom specific BIOS
  • Conformal coating / Protection against high humidity

 

 

 

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Specifications

Microprocessor

CPU: Intel® Xeon® E3-1500 v6 series („Kaby Lake-H“)
OR:
Intel® Core™ 7000E series („Kaby Lake-H“)
CPU: Intel® Core™ 7000E series
Core i7-7820EQ (4x 3.0 / 3.7 GHz, 8 MB, 45/35W)
Core i5-7440EQ (4x 2.9 / 3.6 GHz, 6 MB, 45/35W)
Core i5-7442EQ (4x 2.1 / 2.9 GHz, 6 MB, 25W)
Core i3-7100E (2x 2.9, 3 MB, 35W)
Core i3-7102E (2x 2.1 GHz, 3 MB, 25W)
CPU frequency: Intel® Xeon® E3-1500 v6 series
Xeon E3-1505M v6 (4x 3.0 / 4.0 GHz, 8 MB, GT2, 45 / 35W)
Xeon E3-1505L v6 (4x 2.2 / 3.0 GHz, 8 MB, 25 W)

Memory

EEPROM: 32 kBit (24LC32)
Memory: DDR4-2133: up to 32 GB, w.ECC Option, 2 SO-DIMMs

System interfaces

Gigabit Ethernet: 1x Gigabit Ethernet (Intel® i219-LM)
I²C: 1x I²C, (2nd I²C optional) (master/slave capable)
SATA: 4x SATA Gen3 (up to 6Gb/s)
Serial interfaces: 2x Serial Port (Rx/Tx, Legacy compatible, 4-lanes optional with TQ flexiCFG)
SPI: 1x SPI (for external uEFI BIOS Flash)
USB: 4x USB 3.0 (with USB 2.0 backward compatibility)
8x USB 2.0 (inkl. USB 3.0 Ports)

Other interfaces & busses

Audio Interface: 1x Intel® HD Audio (HDA)
GPIO: 8x GPIO
LPC: 1x LPC bus
PCIe: 8x PCIe Gen 3 (4x1 or 1x4)
1x PEG Port (PCIe x16)
SMBus: 1x SMBus

Security Components

TPM : SLB9660 TPM 1.2, alternatively SLB9665 TPM 2.0

Graphic

Graphic interfaces: Three independent display outputs:
3x Digital Display Interface / DP++ with up to 4K@60Hz
LVDS Interface (18/24 bit, Single/Dual Channel), up to 4K
(optional eDP 1.4 instead of LVDS)
Intel® Quick Sync Video + Wireless Display

General

Dimensions: COM Express® Basic, Type 6, PICMG COM.0 R2.1
125 mm x 95 mm
Board-Controller: TQMx86 board controller with watchdog and TQ flexiCFG
Power: typ. 25-30 W / max. 60 W
(Green ECO-Off: < 0,1W)
RTC: Industrial real time clock (iRTC)
(highly accurate, temperature compensated, minimum input current)
Power supply: 8,5 V - 20 V
5 V Standby (optional)
3 V Batterie / GoldCAP (optional)
Supervisor: Hardware monitor for thermal management
Temperature range: 0°C ... +60°C

Downloads

Manuals

User's Manual MB-COME6-2

User's Manual for the COM Express® mainboard MB-COME6-2.

(MB-COME6-2.UM.0100_01.pdf, 2.6 MByte, 01.06.2017)

User's manual TQMx70EB

User's manual for the x86 module TQMx70EB

(TQMx70EB.UM.0101_01.pdf, 2.1 MByte, 13.06.2017)

TQ-Embedded Product Catalogue

Taking you beyond Embedded Modules. >>> Download our interactive product catalogue.

White paper signal integrity

Learn how to simplify the design of baseboards for our TQ modules. >>> Ask for our white paper.

Support news

3.02.2015

BSP Version 0105 with IPU, VPU and GPU Support

7.07.2014

Version with Kernel 3.12

16.01.2014

CAN, RS485, audio & minor improvements / bugfixes

Attention US customers

US customers please visit the website of our US sales partner 

>>> please click here

Download subscription

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