• Modular and scalable
    Modular and scalable
  • Smallest dimensions
    Smallest dimensions
  • Robust construction
    Robust construction
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Embedded Module TQMx70EB

Embedded Module TQMx70EB
COM Express® Basic Modul (Type 6)

Key functionalities   

  • Intel® Core™ 7000E series / Intel® Xeon®  E3-15xx v6 series ("Kaby Lake-H") with up to Quad-Core 3.7 GHz / 8 MB cache

  • Impressive graphics performance (Intel® Iris™ Pro 630)
    with hardwarebased 10-bit HEVC and VP9 en-/decoding

  • Intel® Optane™ 3D XPoint SSD support

  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC

  • High bandwidth with up to 24 PCIe Gen. 3 lanes (incl. PCIe x16 PEG port)

  • TQMx86 board controller with flexible customization options (flexiCFG)

  • Mobile Intel® 100 series chipset (CM238)

  • TPM 1.2 / 2.0

  • “Green ECO-Off” (minimum of standby power)

  • Watchdog und thermal management

  • Highest reliability, 24/7 certified

  • Quality Made-in-Germany

All Details »

Embedded Module TQMx60EB

Embedded Module TQMx60EB
COM Express® Basic Modul (Type 6)

Key functionalities   

  • Intel® Core™ 6000E series / Intel® Xeon®  E3-15xx v5 series ("Skylake-H") with up to Quad-Core 3.7 GHz / 8 MB cache

  • Impressive graphics performance (Intel® Iris™ Pro)

  • Best in class power optimization

  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC

  • High bandwidth with up to 24 PCIe lanes (Gen. 3) (incl. PCIe x16 PEG port)

  • TQMx86 board controller with flexible customization options (flexiCFG)

  • Mobile Intel® 100 series chipset (CM236)

  • TPM 1.2 / 2.0

  • “Green ECO-Off” (minimum of standby power)

  • Watchdog und thermal management

  • Highest reliability, 24/7 certified

  • Quality Made-in-Germany

All Details »

Embedded Module TQMx50UC

Embedded Module TQMx50UC
COM Express® Compact Module (Type 6)

Key functionalities   

  • Intel® Core™ 5000U series („Broadwell-U") with up to 3.2 GHz / 4 MB Cache
  • Up to 16 GB DDR3L on board memory
  • Best Performance-per-Watt ratio (15W TDP)
  • Reach featured uEFI BIOS with easy-config, multi- setup and touch support
  • TQMx86 board controller with flexible customization options (flexiCFG)
  • TPM 1.2 / 2.0
  • iRTC (highly accurate industrial real time clock)
  • "Green ECO-Off" (minimum of standby power)
  • Watchdog und thermal Management
  • Highest reliability, 24/7 certified
  • Rugged design / Conformal coating capability
  • Quality Made-in-Germany
All Details »

Embedded Module TQMxE38C

Embedded Module TQMxE38C
COM Express™ Compact Module (Type 6)

Key functionalities   

  • Intel® AtomTM E3800 ("Bay Trail-I")
  • Up to 8 GB DDR3L with ECC support, soldered
  • Optimized for ultra low power
  • Extended temperature support 
  • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
  • TQMx86 board-controller with customer specific expandability (flexiCFG)
  • USB 3.0 device interface
  • TPM 1.2 / 2.0
  • iRTC (highly accurate Industrial Real-Time-Clock)
  • "Green ECO-Off" (minimum of standby power)
  • Watchdog and thermal management
  • Highest reliability, 24/7 certified
  • Extra robust Design
  • Formal coating capability

All Details »

Embedded Module TQMxE38M

Embedded Module TQMxE38M
COM Express® Mini Module (Type 10)

Key functionalities   

  • Intel® AtomTM E3800 ("Bay Trail-I")
  • Up to 8 GB DDR3L with ECC support, soldered
  • Optimized for ultra low power
  • Extended temperature support 
  • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
  • TQMx86 board-controller with customer specific expandability (flexiCFG)
  • USB 3.0 device interface
  • TPM 1.2 / 2.0
  • iRTC (highly accurate Industrial Real-Time-Clock)
  • "Green ECO-Off" (minimum of standby power)
  • Watchdog and thermal management
  • Highest reliability, 24/7 certified
  • Extra robust Design
  • Formal coating capability

  • COM Express™ Mini Type 10 (COM.0, R 2.1)

All Details »

Embedded Module TQMxE39C1

Embedded Module TQMxE39C1
COM Express® Compact Module with Intel® Atom™ x5/x7 E3900 and soldered DDR3L with ECC support

Key functionalities   

  • Intel® Atom™ x5/x7 E3900 series (“Apollo Lake-I“)

  • Dual/Quad core computing power with up to 2.5 GHz
  • 4/8 GB DDR3L (dual channel), soldered, ECC
  • High-speed interconnected with Gigabit Ethernet,
  • 8x USB (3.0 / 2.0) and up to 4 PCIe lanes
  • Triple display support (up to 4K UHD) and eDP/LVDS
  • Up to 64 GB eMMC Flash, soldered
  • Extended temperature support
  • Watchdog und thermal management
  • Highest reliability, 24/7 certified
  • Conformal coating (on request) and optimized coolingsolutions for ruggedized applications
All Details »

Embedded Module TQMxE39C2

Embedded Module TQMxE39C2
COM Express® Compact Module with Intel® Atom™ x5/x7 E3900 and SO-DIMM memory

Key functionalities   

  • Intel® Atom™ x5/x7 E3900 series (“Apollo Lake-I“), Pentium® N4200 and Celeron® N3350 processors
  • Dual/Quad core computing power with up to 2.5 GHz
  • Up to 8 GB DDR3L (2 SO-DIMMs), non-ECC
  • High-speed interconnected with Gigabit Ethernet, 8x USB (3.0 / 2.0) and up to 4 PCIe lanes
  • Triple display support (up to 4K UHD) and eDP/LVDS
  • Up to 64 GB eMMC Flash, soldered
  • Watchdog und thermal management
  • Highest reliability, 24/7 certified
All Details »

Embedded Module TQMxE39M

Embedded Module TQMxE39M
COM Express® Mini Module (Type 10)

Key functionalities   

  • Intel® Atom™ x5/x7 E3900 series ("Apollo Lake-I"), Pentium® N4200 and Celeron® N3350 processors

  • Dual/Quad core computing power with up to 2.5 GHz
  • 4/8 GB DDR3L (dual channel), soldered
  • High-speed interconnected with Gigabit Ethernet, 8x USB (3.0 / 2.0) and up to 4 PCIe lanes 
  • Dual Display support with DP/HDMI (up to 4K UHD) and eDP or LVDS
  • Up to 64 GB eMMC Flash, soldered
  • Extended temperature Support
  • Watchdog und thermal Management
  • Highest reliability, 24/7 certified
  • Conformal coating (optional) and optimized cooling solutions for ruggedized applications
All Details »

Embedded Module TQMxE39S

Embedded Module TQMxE39S
SMARC Module with Intel® Atom™ x5/x7 E3900

Key functionalities   

  • Supports Intel® Atom™ x5/x7 E3900 series, Pentium® N4200 and Celeron® N3350 processors
  • Dual / Quad core computing power with up to 2.5 GHz
  • 4 / 8 GB LPDDR4
  • High-speed interconnected with Gigabit Ethernet, 6x USB (3.0 / 2.0) and up to 4 PCIe lanes
  • Triple Display support with DP/HDMI (up to 4K UHD) and eDP/LVDS
  • Up to 64 GB eMMC flash, soldered
  • Small size (82 x 50 mm)
  • Extended temperature support
All Details »

TQ-Embedded Product Catalogue

Taking you beyond Embedded Modules. >>> Download our interactive product catalogue.

White paper signal integrity

Learn how to simplify the design of baseboards for our TQ modules. >>> Ask for our white paper.

Support news

3.02.2015

BSP Version 0105 with IPU, VPU and GPU Support

7.07.2014

Version with Kernel 3.12

16.01.2014

CAN, RS485, audio & minor improvements / bugfixes

Attention US customers

US customers please visit the website of our US sales partner 

>>> please click here

Download subscription

With a new feature on the TQ website, you now have the opportunity to subscribe for a modification newsletter. As soon as new, important documents such as User Manuals or new BSP revisions are set and you have subscribed to the modification newsletter for this product, you will automatically receive a message that informs you about the new download. 

>>> more