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COMSys

Developed within the Intel® Embedded Building Blocks Initiative

 

A modular Embedded PC platform
based on COM Express

Suitable for:

  • Individual Embedded systems (Integration in devices / equipments)
  • Embedded PCsIndustrial PCs / BoxPCs
  • Panel-PCs
  • Display systems / Digital Signage

Embedded PC - as easy as a standard PC

 

Key functionalities

  • Modular concept
  • Scalable (from Intel®Atom bis  Intel®Core i7)
  • Space-saving through slim profile 
  • Optimal thermal connection and simple system integration
  • Mainly passive cooling
  • Flexible extendibility
  • Embedded features
  • Long-term availability
  • High level of functional reliability and durability (24/7)
  • High quality "Made in Germany"
  • Realisation of hardware kits, Box-PCs and Panel-PCs/HMI

Now also available with Intel Core 3rd generation ("Ivy Bridge")!

Übersicht

The COM Express mainboard (carrier board) MB-COME-1 in combination with a standard COM Express module forms a very compact hardware kit that can be used for a freely scalable embedded PC platform thanks to its modular design. Because of this – with uniform interfaces and mechanical dimensions – the PC system can be easily adjusted to suit the requirements of the application.

 

The many extension options and storage media that can be added offer a high level of flexibility and allow functionalities and performance to be extended easily, quickly and inexpensively.

 

Typical uses are found in embedded server applications, PC systems for automation, visualisation and monitoring and all applications that place high demands on quality, durability and long-term availability.

 

Based on COMSys specific housing-solutions BoxPCs and Panel-PCs are available. There are standard till extremely rugged, dust and spray proofed designs obtainable.

 

For efficient system integration ask for our detailed 3D STEP data.

 

Use the link at the ordering information below to get more information about the different products.

Bestellinformationen

Bestellinformationen

COM Express Mainboard MB-COME-1

Mainboard for COM Express Modules (Type 2)

The COM Express mainboard is part of the Embedded Building Blocks (COMSys embedded PC platform) and could be delivered also seperately.

 

  • Tested with many COM Express modules from different CPU module vendors.
  • Suitable for "rapid prototyping" and also for massproduction in low, middle and high volumes.
  • External Interfaces: 2x Gigabit Ethernet, 4x USB, DVI-I, RS-232, Power- Button, Reset-Button
  • Internal Interfaces: CompactFlash socket, CFast socket, socket for 2,5” HDD/SSD, SATA, LVDS&HMI interface, 2x USB, System connector, IO Extension Interface, Mini PCIe socket, Riser interface for PCI/PCIe add in cards, 20-pol. ATX Power input, battery (socket version)
  • Expandable with standard add in cards (PCI, PCIe, Mini PCIe)

Use this link to get further information...

Preisauskunft anfordern

COMKits (mainboard + module + internal memory + cooling solution)

Hardwarekits for integration into overall systems and projectspecific housings

Embedded PC Kit (completely mounted/proved) consisting of

 

  • Thermal interface
  • COM Express CPU module (Type 2)
  • DDR3 RAM
  • Mainboard MB-COME-1L
 

Use this link to get further information...

Preisauskunft anfordern

COMBox-STD

Flexible BoxPC with long range availability

 

Key functionalities

  • Scalable from Intel Atom up to Intel Core 3rd generation ("Ivy Bridge")
  • 2,5" SSD / HDD, CompactFlash, CFast
  • Expandable with standard add in cards 
    (1x Mini PCIe and 1x PCI oder PCIe)
  • Modular setup for individual configuration
  • Compact architecture
  • Durable through industrial design
  • Long-term availabilty

 

 

Preisauskunft anfordern

COMBox-EMB

Rugged BoxPC (active cooled) with Intel Core CPUs

 

Versions

  • COMBox-EMB: Rugged BoxPC (active cooled) with
    up to Intel Core 3rd generation CPUs,
    optionally with protection class IP53
Preisauskunft anfordern

COMBox-INNOVO

COMBox-INNOVO-IAP und COMBox-INNOVO-VARIO:
  • Rugged high quality Chassis in Aluminium "Made in Germany"
  • Closed housing and housing with openings for natural airflow available
  • Optimized passive cooling
  • EMI tested regarding:
    EN55022:2006+A1:2007 Class A (emitted)
    EN55024:2010 (immunity)
  • Long term available
  • High reliability and lifetime (24/7)
  • Internal fan for special temperature requirements (optional)

For details follow this link...

Preisauskunft anfordern

COMPanel - project specific COMSys HMI solutions

With COMSys you can realize your own HMI / Panel-PC very flexible and efficient.

 

  • All performance classes from  Intel Atom up to Intel Core i7
  • Single / dual / quad core
  • up to 16 GB DDR3
  • Typical display sizes from 15" up to 23"
  • optional with Multitouch (Projected Capacitive Touch)
  • Easy to realize fanless systems
  • Protection class up to IP65
Do your own panel system integration with COMSys Embedded PC platform or ask for an individual solution from TQ.

 

Preisauskunft anfordern

Whitepaper Signalintegrität

Erfahren Sie, wie das Design von Basisboards für unsere TQ-Module vereinfacht werden kann. >>> Fordern Sie dazu unser Whitepaper an.

Neue Produkte

12.11.2014

Intel® Atom™-Technologie in neuer Design-Qualität

12.11.2014

Neue Trends erfordern innovative Produkte

Neues aus dem Supportbereich

8.08.2014

BSP Version 0104 mit IPU, VPU und GPU Unterstützung

7.07.2014

Version mit Kernel 3.12 mit Device Tree Unterstützung

23.04.2014

Auflösungen bis Full-HD sind jetzt realisierbar

Download Abonnement

Mit einer neuen Funktion auf der TQ-Webseite haben Sie ab sofort die Möglichkeit, einen Änderungshinweis zu abonnieren. Sobald neue, wichtige Dokumente wie z.B. User Manuals oder neue BSP-Revisionen eingestellt werden und Sie den Änderungshinweis für dieses Produkt abonniert haben, erhalten Sie automatisch eine Nachricht, die Sie über den neuen Download informiert. 

>>> Und so geht's